Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness distribution in the hole is an important factor in double sided and also multilayered PCB . Here the plating process is carried using pulse reverse plating on the printed circuit board . Pulse Reverse Electroplating is similar to DC plating but it has a square wave along with a periodic reverse current.[1]In periodic reverse current process a layer is produced on the cathode surface with a lower metal Concentration. Periodic reverse current help to obtain a plating thickness which is uniform in nature and also in nano structured grain size which results in high binding of the metal with the substrate

1. .Wenlu, D.Wanchun and L.B.Huan,2000 “Studies of additives in acid sulfate copper pulse reversal current electrodeposition”, Circuitree, vol.14,no.11 48-50
2. Beica, R., C. Sharbono, and T. Ritzdorf. 2008.“Through silicon via copper electrodeposition for 3D integration”. Proc 58Th Electronic Components & Technology Conference.pp.577-583.
3. David Flynn and Marc P. Y. Desmulliez 2010“Influence of Pulse Reverse Plating on the Properties of Ni-Fe Thin Films” IEEE Transactions on Magnetics, Vol. 46, NO. 4, April pp.979-985
4. W.kim and R.weil,1989 “Pulse plating effects in nickel electrodeposition”,Surface Coating Technology38,289.
5. P.T.Tang, P.Leisner and P.Moller, “Improvement of Nickel Deposit Characteristics by Pulse. Plating", ASEF surfin’93 pp 249-256
6. R.Retallick,R.Blake,D.Desalvo “Pulse plating”.Printed circuit fabricationVol 23,No.1pp 32-38
7. S.Jayapoorani, Dalim kumar Ghosh 2011 “A Novel Technique to Perform Plating on Printed Circuit Board” American journal of applied sciences,Vol 8,pp989-991
8. J-Y Fei,G.D.Wilcox 2005 Electrochim.Acta 50,2693-2698
9. M.S.Chandrasekar,Malathy pushpavanam2008. “Pulse and reverse pulse plating- conceptual, advantages and applications” electrochimica Acta533313-3322
10. P.Leisner,G.Bech-Neilsen,P.Moller 1992. “Throwing power in pulse reverse plating from an acid copper bath”Surface finishing
11. Erb U, T.Turi,1995 “Nanostuctured Material”,Material science and Engineering 6,pp533
12. Jen Tsung Luo, Wen Bing Lin, Laurence Shang 2008. “The Effect of Pulse-Reverse Plating Time on Blind Micro Via Filling”IEEE pp 395-398
13. Z. N. Farhat, Y. Ding, D. O. Northwood, A. T. Alpas,1996. “Effect of grain size on friction and wear of nanocrystalline aluminium”,Material Science & Engineering. A, 206 pp 302-319.

Pulse reverse plating PCB silver Nanostructured coating current density