International Conference on VLSI, Communication & Instrumentation |
Foundation of Computer Science USA |
ICVCI - Number 8 |
None 2011 |
Authors: Roshini T V, Dr.N.Muruganand |
f444d175-11eb-46d4-8097-a60b4c2c0f70 |
Roshini T V, Dr.N.Muruganand . Electronic Cooling By LASER. International Conference on VLSI, Communication & Instrumentation. ICVCI, 8 (None 2011), 1-3.
Even in the age of green computing and lower power manufacturing technology, thermal management, specifically heat mitigation continues to be a challenge. That is the heat produced in the semiconductor is the main problem faced by the design engineer. When a junction temperature of semiconductor rises above its max allowable temperature, there is a need to dissipate this temperature or else the device will break down. a semiconductor device include an intermediate layer moderates thermal stress resulting from a difference between the thermal expansion of the semiconductor element and thermal expansion of the heat sink arising due to heat produced by the semiconductor . This paper deals with laser cooling. Which provide an efficient heat transfer from the device to the environment. Cooling systems an important part of any e device.