CFP last date
20 January 2025
Reseach Article

Performance and Analysis of Voltage Scaled Repeaters for Multi-Walled Carbon Nanotubes as VLSI Interconnects

by Jatinderpal, Chakshu Goel, Karamjit Singh Sandha
International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 93 - Number 8
Year of Publication: 2014
Authors: Jatinderpal, Chakshu Goel, Karamjit Singh Sandha
10.5120/16235-5756

Jatinderpal, Chakshu Goel, Karamjit Singh Sandha . Performance and Analysis of Voltage Scaled Repeaters for Multi-Walled Carbon Nanotubes as VLSI Interconnects. International Journal of Computer Applications. 93, 8 ( May 2014), 18-23. DOI=10.5120/16235-5756

@article{ 10.5120/16235-5756,
author = { Jatinderpal, Chakshu Goel, Karamjit Singh Sandha },
title = { Performance and Analysis of Voltage Scaled Repeaters for Multi-Walled Carbon Nanotubes as VLSI Interconnects },
journal = { International Journal of Computer Applications },
issue_date = { May 2014 },
volume = { 93 },
number = { 8 },
month = { May },
year = { 2014 },
issn = { 0975-8887 },
pages = { 18-23 },
numpages = {9},
url = { https://ijcaonline.org/archives/volume93/number8/16235-5756/ },
doi = { 10.5120/16235-5756 },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Journal Article
%1 2024-02-06T22:15:16.607864+05:30
%A Jatinderpal
%A Chakshu Goel
%A Karamjit Singh Sandha
%T Performance and Analysis of Voltage Scaled Repeaters for Multi-Walled Carbon Nanotubes as VLSI Interconnects
%J International Journal of Computer Applications
%@ 0975-8887
%V 93
%N 8
%P 18-23
%D 2014
%I Foundation of Computer Science (FCS), NY, USA
Abstract

Multi-walled carbon nanotubes (MWCNT) are promising candidates for futuristic Nano-electronic applications. MWCNT have potential to replace on-chip copper (Cu) interconnects due to their large conductivity and current carrying capabilities. Delay is one of the major design constraints in very large scale integration (VLSI) circuits. This paper presents an analysis of propagation delay and effect of repeater insertion on propagation delay for both MWCNT and Cu interconnects at different technology nodes viz 32nm and 22nm. In addition this paper deals with effect of voltage scaling in repeaters for long interconnects length in VLSI circuits in terms as propagation delay. It has been observed that propagation delay reduces with increase in bias voltage of the repeater at different interconnects length and technology nodes (32nm. 22nm).

References
  1. Mayank Kumar Rai, Sankar Sarkar, "Carbon Nano Tube as VLSI Interconnect", Electronic Properties of Carbon Nanotubes,intech,2011
  2. Steinhogl, W. , Schindler, G. , Steinlesberger, G. , Traving, M. , Engelhardt, M. : 'Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller', J. Appl. Phys. , 2005.
  3. Naeemi et al. "Performance comparison between carbon nanotube and copper interconnects for giga scale integration (GSI)", Electron Device letters, vol. 26, No. 2, pp. 84-86, 2005 .
  4. H. Li, C. Xu, N. Srivastava and K. Banerjee, "Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status and Prospects," IEEE Trans. Electron Devices, vol. 56, no. 9, pp. 1799-1821, Sep. 2009.
  5. K. Banerjee and N. Srivastava, "Are carbon nanotubes the future of VLSI interconnections?," in Proc. Des. Autom. Conf. , 2006, pp. 809–814.
  6. Rajeevan Chandel, S. Sarkar. , Repeater insertion in global interconnects in VLSI circuits, Emerald Group Publishing Limited, Microelectronics International, 2005.
  7. N. Srivastava, H. Li, F. Kreupl, and K. Banerjee, "On the applicability of single-walled carbon nanotubes as VLSI interconnects," IEEE Trans. Nanotechnol. , vol. 8, no. 4, pp. 542–559, Jul. 2009.
  8. Tarun Parihar, Abhilasha Sharma, "A comparative study of Mixed CNT bundle with Copper for VLSI Interconnect at 32nm", International Journal of Engineering Trends and Technology (IJETT), April 2013.
  9. H. J. Li, W. G. Lu, J. J. Li, X. D. Bai and C. Z. Gu, "Multichannel ballistic transport in multiwall carbon nanotubes," Phys. Rev. Lett. , vol. 95, p. 86601, 19 August 2005.
  10. H. Li, W. Y. Yin, K. Banerjee, and J. F. Mao, "Circuit modelling and performance analysis of multi-walled carbon nanotube interconnects," IEEE Trans. Electron Devices, vol. 55, no. 6, 2008.
  11. A. Naeemi and J. D. Meindl, "Compact physical models for multiwall carbon-nanotube interconnects," IEEE Electron Device Lett. , vol. 27, no. 5, pp. 338–340, May 2006.
  12. Y. Xu and A. Srivastava, "A Model of Multi-Walled Carbon Nanotube Interconnects," Proc 52nd IEEE Int. Midwest Sym. Cir. and Sys, 2009.
  13. P. J. Burke, "Lüttinger Liquid Theory as a Model of the Gigahertz Electrical Properties of Carbon Nanotubes," IEEE Trans. Nanotechnology, vol. 1, no. 3, pp. 129-144, Sep. 2002.
  14. V. V. Deodhar, et al. , "Voltage-scaling and repeater insertion for highthroughput low-power interconnects", Proc. ISCAS'03 5, pp. v-349–352, 2003
  15. Iman Madadi, Hossein Aghababa, and Behjat Forouzandeh, "Multi-Walled Carbon NanoTube Impedance", IEEE International Conference, 2010.
  16. P. G. Collins and P. Avouris, "Multishell conduction in multiwalled carbon nanotubes," Appl. Phys. A, Solids Surf. , vol. 74, no. 3, pp. 29–332, Mar. 2002.
  17. Ashok Srivastav, Yao Xu, Ashwani K. Sharma "Carbon nanotubes for next generation very large scale integration interconnects", journal of nanophotonics, vo. No. 4,041690, May 2010.
  18. M. Gholipour, N. Masoumi: "Efficient inclusive analytical model for delay estimation of multi-walled carbon nanotube interconnects" IET Circuits Devices Syst. , 2012.
  19. Manoj Kumar Majumder, Nisarg D. Pandya, B. K. Kaushik, and S. K. Manhas "Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area", Electron Device Letters, IEEE,2012
  20. J. F. Xu, H. Li, W. Y. Yin, J. F. Mao, and L. W. Li, "Extraction of three-dimensional interconnects using element-by-element finite element method and preconditioned conjugate gradient technique," IEICE Trans. Electron. , vol. E90C, no. 1, pp. 179–188, Jan. 2007.
Index Terms

Computer Science
Information Sciences

Keywords

Carbon Nanotubes (CNT) Multi-walled CNT (MWCNT) Interconnects Circuit Model.