We apologize for a recent technical issue with our email system, which temporarily affected account activations. Accounts have now been activated. Authors may proceed with paper submissions. PhDFocusTM
CFP last date
20 November 2024
Reseach Article

Investigations on the Characteristics of Pulse Plating on Printed Circuit Board

by S. Jayapoorani, Dalim Kumar Ghosh
International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 68 - Number 8
Year of Publication: 2013
Authors: S. Jayapoorani, Dalim Kumar Ghosh
10.5120/11598-6961

S. Jayapoorani, Dalim Kumar Ghosh . Investigations on the Characteristics of Pulse Plating on Printed Circuit Board. International Journal of Computer Applications. 68, 8 ( April 2013), 11-16. DOI=10.5120/11598-6961

@article{ 10.5120/11598-6961,
author = { S. Jayapoorani, Dalim Kumar Ghosh },
title = { Investigations on the Characteristics of Pulse Plating on Printed Circuit Board },
journal = { International Journal of Computer Applications },
issue_date = { April 2013 },
volume = { 68 },
number = { 8 },
month = { April },
year = { 2013 },
issn = { 0975-8887 },
pages = { 11-16 },
numpages = {9},
url = { https://ijcaonline.org/archives/volume68/number8/11598-6961/ },
doi = { 10.5120/11598-6961 },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Journal Article
%1 2024-02-06T21:27:15.946832+05:30
%A S. Jayapoorani
%A Dalim Kumar Ghosh
%T Investigations on the Characteristics of Pulse Plating on Printed Circuit Board
%J International Journal of Computer Applications
%@ 0975-8887
%V 68
%N 8
%P 11-16
%D 2013
%I Foundation of Computer Science (FCS), NY, USA
Abstract

A research is carried to evaluate the performance between the pulse plating and pulse reverse plating technique. In both the technique employed the composition of the bath is kept constant. Both the plating is done on a double sided Printed Circuit Board for the connection between the two layers. The metal used for plating is silver rather than the conventional copper. The evaluation of parameters such as hardness and current efficiency is carried out.

References
  1. K. C. Yung, T. M Yue, K. C. Chan and K. F. Yeung (2004) "The effect of waveform for pulse plating on copper plating distribution of microvia in PCB Manufacture" Int. J Adv Manuf Technol(2004) 23:245- 248
  2. Beica, R. , C. Sharbono, and T. Ritzdorf. . "Through silicon via copper electrodeposition for 3D integration". Proc 58Th Electronic Components & Technology Conference. 2008, pp. 577-583.
  3. W. kim and R. weil, "Pulse plating effects in nickel electro deposition", Surface Coating Technology1989,vol . 38,pp 289.
  4. M. S. Chandrasekar, Malathy Pushpavanam, "Pulse and pulse reverse plating—Conceptual,advantages and applications", Electrochimica Acta 53 (2008)pp 3313–3322
  5. B. D. Dunn, A. de Rooij & D. S. Collins, " Corrosion of Silver-Plated Copper Conductors", ESA Journal 1984, Vol. 8 pp 307-335
  6. Nassar Kanani , "Eletroplating Basic Principles , processes and Practice",pp ISBN-10: 1-85617-451-4,
  7. P. T. Tang, P. Leisner, and P. Møller, AESF SurFin '93 _American Electroplaters and Surface Finishers Society, Orlando, FL, 1993, p. 249–256.
  8. B. N. Popov, Ken-Ming Yin and R. E. White " Galvanostatic Pulse and Pulse Reverse Plating of Nickel-Iron Alloys from Electrolytes Containing, Organic Compounds on a Rotating Disk Electrode" Journal of Electrochemical society vol 140, No 5 , 1993.
  9. D. L. Grimmett, M. Schwartz, K. Nobe, The Electrochem. Soc. Inc. 140 (1993) 973
  10. Bella H. Chudnovsky " Degradation of Power Contacts in Industrial Atmosphere:Plating Alternative for Silver and Tin" IEEE 2003 pp 98-106
  11. S. Jayapoorani, Dalim Kumar Ghosh, AzadMohammed Shaik "A Novel Technique to Perform Plating on Printed Circuit Board" American journal of applied sciences, Vol 8,2011 pp 989-991
  12. S. Jayapoorani,Dalim Kumar Ghosh "Effect of Pulse plating using Silver on Printed Circuit Boards" International journal of Communication, computation and Innovation ,Vol 2 Issue 2 ,2011 pp143- 147
  13. S. Jayapoorani,Dalim Kumar Ghosh "Effect of Pulse Reverse plating using silver on Printed circuit Board" International Journal of Computer applications ,Issue 10,2012
  14. Bosshart, W. C. ,(2008). Printed Circuit Boards Design and Technology. Tata Mc Graw Hill publishing Company. 270-290 ISBN 0-07-451549-7.
Index Terms

Computer Science
Information Sciences

Keywords

Printed Circuit Board Pulse plating Pulse Reverse plating silver current efficiency