We apologize for a recent technical issue with our email system, which temporarily affected account activations. Accounts have now been activated. Authors may proceed with paper submissions. PhDFocusTM
CFP last date
20 November 2024
Call for Paper
December Edition
IJCA solicits high quality original research papers for the upcoming December edition of the journal. The last date of research paper submission is 20 November 2024

Submit your paper
Know more
The week's pick
Responsive image
An Efficient Restoration Method for the Faint Dot Matrix Images

Ao Zhu Peng Cao
Random Articles
Reseach Article

Computer Modeling to Predict the Impact of Cold Air Stream on Multi-Chip Memory

by Amal El Berry, Kusum Yadav, Imtithal A. Saeed
journal cover thumbnail

International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 59 - Number 3
Year of Publication: 2012
Authors: Amal El Berry, Kusum Yadav, Imtithal A. Saeed
10.5120/9527-3948

Amal El Berry, Kusum Yadav, Imtithal A. Saeed . Computer Modeling to Predict the Impact of Cold Air Stream on Multi-Chip Memory. International Journal of Computer Applications. 59, 3 ( December 2012), 11-14. DOI=10.5120/9527-3948

@article{ 10.5120/9527-3948,
author = { Amal El Berry, Kusum Yadav, Imtithal A. Saeed },
title = { Computer Modeling to Predict the Impact of Cold Air Stream on Multi-Chip Memory },
journal = { International Journal of Computer Applications },
issue_date = { December 2012 },
volume = { 59 },
number = { 3 },
month = { December },
year = { 2012 },
issn = { 0975-8887 },
pages = { 11-14 },
numpages = {9},
url = { https://ijcaonline.org/archives/volume59/number3/9527-3948/ },
doi = { 10.5120/9527-3948 },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Journal Article
%1 2024-02-06T21:05:08.043529+05:30
%A Amal El Berry
%A Kusum Yadav
%A Imtithal A. Saeed
%T Computer Modeling to Predict the Impact of Cold Air Stream on Multi-Chip Memory
%J International Journal of Computer Applications
%@ 0975-8887
%V 59
%N 3
%P 11-14
%D 2012
%I Foundation of Computer Science (FCS), NY, USA
Abstract

RAM was a specialized electronic chip which multiple integrated circuits (ICs), semiconductor or other discrete components were packaged onto a unifying substrate. Facilitating their use as a single component (as though a larger IC). This paper presented model calculated the temperature distribution on four parallel memory modules and studied the effect of running a stream of cooling air . The density of the air domain depended on temperature, and introduced this influence with the ideal gas law. The inlet velocity of the air was given as a parabolic profile with a maximum velocities of 0. 20, 0. 21,0. 22,0. 23, 0. 24 and 0. 25 m/s, at this flow rates the flow will be laminar. This procedure yields average temperatures of 29. 2, 32. 4, 34. 2 and 34. 6 °C. The model defined the heat balance in the memory subdomains plus the air subdomain. The temperature field and flux were continued across these subdomains, which mean that there was no need specify any boundaryconditions between the memory and the air subdomain. The model used material properties of the IC-package material FR4 for the memory modules, and in the surrounding subdomain it used the properties for air.

References
  1. T. Hamamoto, S. Sugiura, and S. Sawada. ( 1998) ( "On the retention time distribution of dynamic random access memory (dram). IEEE Transactions on Electron Devices, 45(6):pp. 1300–1309.
  2. R. Sabelka*, S. Selberherr (2001) "A finite element simulator for three-dimensional analysis of interconnect structures" Microelectronics Journal 32 pp. 163–171.
  3. Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-SiongTeo, D. Pinjala and Srinivasamurthy Sampath(2004) "Thermo-mechanical finite element analysis in a multichip build up substrate based package design" Microelectronics Reliability 44 pp 611–619.
  4. Z. G. Wang, X. T. Zua, Y. Q. Fu and L. M. Wang (2005) " Temperature memory effect in TiNi-based shape memory alloys" Thermochimica Acta 428 pp 199–205.
  5. X. M. He, L. J. Rong, D. S. Yan, Y. Y. Li (2005)" Temperature memory effect of Ni47Ti44Nb9 wide hysteresis shape memory alloy" Scripta Materialia 53 pp. 1411–1415.
  6. Mousa M. Mohamed (2006) "Air cooling characteristics of a uniform square modules array for electronic device heat sink"Applied Thermal Engineering 26 pp 486–493
  7. MEHMET ILICAK, ALI ECDER* and ERHAN TURAN(2007)"Operator splitting techniques for the numerical analysis of natural convection heat transfer" International Journal of Computer Mathematics Vol. 84, No. 6, June, pp. 783–793.
  8. K. Sikka, "Multi-chip package thermal management of IBM z-Server systems",ITHERM, 2007.
  9. R. Yavatkar, M. Tirumala, "Platform wide innovations to overcome thermal challenges", THERMES, 2007.
  10. YanjunZheng, Juntao Li, Lishan Cui (2009)" Repeatable temperature memory effect of TiNi shape memory alloys" Materials Letters 63pp. 949–951.
  11. A. Kubilay, S. Zimmermann, I. Zinovik1, B. Michel, and D. Poulikakos (2011)"Compact Thermal Model for the Transient Temperature Prediction of a Water-Cooled Microchip Module in Low Carbon Emission Computing"Numerical Heat Transfer, Part A, 59: pp. 815–835.
  12. A. J. Chorin, 1968, "On convergence of discrete approximations to the Navier-Stokesequations," Math. Comp. , vol. 22, pp. 745–762.
  13. Guermond, L. Quartapelle, 1998, "On the approximation of unsteady Navier-Stokes equations by finite element projection method ," Numer. Math, p. 217 in: J. -L. vol. 80, pp. 207–238.
  14. Klaus-Jürgen Bathe"Finite Element Method" textbook,13 JUN 2008.
  15. A. Ortega, "Air Cooling of Electronics: A Personal Perspective 1981-2001," presentation material, IEEE SEMITHERM Symposium, 2002
Index Terms

Computer Science
Information Sciences

Keywords

Memory air velocity Heat source

Powered by PhDFocusTM