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Reseach Article

Analysis of Heat Transfer Refrigeration Systems of Data Processing Units

by Fabiano Stingelin Cardoso, João Nazareno Nonato Quaresma, Emanuel Negrão Macêdo
International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 177 - Number 22
Year of Publication: 2019
Authors: Fabiano Stingelin Cardoso, João Nazareno Nonato Quaresma, Emanuel Negrão Macêdo
10.5120/ijca2019919657

Fabiano Stingelin Cardoso, João Nazareno Nonato Quaresma, Emanuel Negrão Macêdo . Analysis of Heat Transfer Refrigeration Systems of Data Processing Units. International Journal of Computer Applications. 177, 22 ( Dec 2019), 29-40. DOI=10.5120/ijca2019919657

@article{ 10.5120/ijca2019919657,
author = { Fabiano Stingelin Cardoso, João Nazareno Nonato Quaresma, Emanuel Negrão Macêdo },
title = { Analysis of Heat Transfer Refrigeration Systems of Data Processing Units },
journal = { International Journal of Computer Applications },
issue_date = { Dec 2019 },
volume = { 177 },
number = { 22 },
month = { Dec },
year = { 2019 },
issn = { 0975-8887 },
pages = { 29-40 },
numpages = {9},
url = { https://ijcaonline.org/archives/volume177/number22/31030-2019919657/ },
doi = { 10.5120/ijca2019919657 },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Journal Article
%1 2024-02-07T00:46:37.029366+05:30
%A Fabiano Stingelin Cardoso
%A João Nazareno Nonato Quaresma
%A Emanuel Negrão Macêdo
%T Analysis of Heat Transfer Refrigeration Systems of Data Processing Units
%J International Journal of Computer Applications
%@ 0975-8887
%V 177
%N 22
%P 29-40
%D 2019
%I Foundation of Computer Science (FCS), NY, USA
Abstract

It is well known that the highest temperature under which a processor can operate without mechanical and digital interruptions is 90 ° C. For that reason, by approaching the Project of heat sinks of processors concerning to computer architecture, at Courses of Computer Science. It is important to point out the use of appropriate heat sinks at long last this type of hardware can compromise the life of the computer, as well as to jeopardize the performance of software applications in case it has not had the due heat withdrawal when it is necessary to use 100% of the processing capacity. Thus the aim of this research paper is to explore the thermal transfers by using the logarithmic mean temperature difference method in an application of liquid cooling system for computer. As the cooling fluid and the liquid cooling kit achieved for the experiment are from Thermaltake, benchmark company in that segment. An experimental bench for flow measuring, of input and output temperature of fluid of water block and data collection were assembled. Under maximum working load the processor was submitted and the maximum temperatures were 75˚C with the standard fan (heatsink + cooler) and of 53˚C with the watercooler kit, at an average flow rate 2825 ml / min. The maximum operating efficiency achieved was of 0,439 Watts of energy savings in comparison with the traditional heatsink that uses ventilation. That efficiency of performance by consuming less energy and increases the processing, proves that the well-sized computer architecture for choosing processor-cooling hardware ensure satisfactory performance in software applications which require high data processing and also decrease the cost of operation of application of long term.

References
  1. MANO, M. M. Computer system architecture, 1993. Prentice Hall, v. 3, 1993.
  2. VERAS, M.V.S.N. Data Center. Componente central da infraestrutura de TI. Brasport, 2009.
  3. LORENZONI, R. K. Análise de desempenho e consumo energético entre processadores arm e x86. 2012.
  4. LEE, M., KWANG, K., HOPKINS, R., GAWLIK, K. Thermal conductivity measurements of copper-coated metal hydrides (LaNi5, Ca0.6Mm0.4Ni5 and LaNi4.75Al0.25) for use in metal hydride hydrogen compression systems. Int J Hydrogen Energy, v. 34 (7), pp. 3185-3190, 2009.
  5. KIT THERMALTAKE. Disponível em: < https://www.thermaltake.com/liquid_cooler/liquid_cooler_/lcs_kits/c_00002571/pacific_rl240_water_cooling_kit/Design.htm>. Acesso em: Junho de 2018.
  6. GROLL, E. et al. Mathematical modeling of scroll compressors—part I: compression modeling. International Journal of Refrigeration, v.25, pp. 731-750, 2002.
  7. OLIVEIRA, Rony. Análise da Transferência de Calor de Fluidos Térmicos aditivado com Etilenoglicol e Polímeros. Natal/ RN. Dissertação (mestrado) – Universidade Federal do Rio Grande do Norte, Centro de Tecnologia, 2016.
  8. HAYWOOD, A.M. et al. Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In: 13th IEEE intersociety conference on thermal and thermomechanical phenomena in electronic systems (ITherm), San Diego, 2012.
  9. UPADHYA, G. et al. Micro-scale liquid cooling system for high heat flux processor cooling applications. In: 22nd IEEE Semi-therm Symposium, 2006.
  10. BEJAN, A., ERRERA, M. Deterministic tree networks for fluid flow: geometry for minimal flow resistance between a volume and one point. Fractals, v. 05, n. 04, p. 685-695, 1997.
  11. BUCCI, A. et al. Water single-phase fluid flow and heat transfer in capillary tubes. In: 1st International Conference on Microchannels and Minichannels, pp. 319-326, January 1st, 2003.
  12. SIDDIQUE, A. B., PRABHU, K. N.; Replacement of heat sink fan by nano coolants for enhancement of CPU efficiency, National Conference on Challenges in Research & Technology in the Coming Decades, 2013.
  13. MIHAI, I. Heat Transfer in Minichannels and Microchannels CPU Cooling Systems, Heat Transfer - Theoretical Analysis, Experimental Investigations and Industrial Systems, Prof. Aziz Belmiloudi (Ed.), University of Suceava – Romania, 2015.
  14. CPU-Z. Disponível em: < https://www.cpuid.com/softwares/cpu-z.html>. Acesso em: Fevereiro de 2019.
  15. HWINFO. Disponível em: < https://www.hwinfo.com/>. Acesso em: Fevereiro de 2019.
Index Terms

Computer Science
Information Sciences

Keywords

TDP of Processors Thermal Transfers Water Block Liquid Cooling Watercooler Kit.